| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device which can be mounted on a circuit board, which can be miniaturized, which can be replaced after its mounting operation, which can make the operating test of a semiconductor chip, in which a solder bonded part can be inspected visually and in which the chip can be encapsulated easily with a resin. SOLUTION: A board 3 is bonded, by an adhesive 4, to the end part of the circuit formation face 1a of a semiconductor chip 1, the semiconductor chip 1 and the board are connected electrically by metal thin wires 5, an encapsulating resin part 6 is formed so as to come into contact with the circuit formation face 1a of the semiconductor chip 1 and with the inner side face 3d of the board 3, and bumps 7 by which a semiconductor device is mounted on a circuit board are formed on the bump formation face 3b exposed from the encapsulating resin part 6 of the board 3. Consequently, in the semiconductor device, the bumps are exposed at the end part of the device even after the device has been connected to the board, the device can be replaced, and every bonded part can be inspected. Since the resin-based board is bonded with the adhesive of a low elastic modulus, the fracture of a solder bonded part is not generated. The board 3 is situated inside the projection face of the circuit formation face, and the device becomes a small size which is nearly the same size as the chip 1. The chip 1 is protected by the package, and an operating test can be made easily.</p> |
