Semiconductor device, its lead frame, and heat spreader having through holes

摘要

In a lead frame for a semiconductor device which includes a multiplicity of leads, and a heat spreader having an edge to which the leads are bonded by an insulating material coated with an adhesive, and a central portion to which a semiconductor chip is bonded, the heat spreader has a ring-shaped portion defined between its central portion and the inner ends of the leads, and having a width of at least 0.5 mm. The ring-shaped portion has a plurality of through holes occupying not more than 60% by area of that portion, and each of those holes has a width of at least 0.5 mm.