发明名称 HEAT-INSULATION METHOD FOR CEILING IN HOUSE
摘要 PROBLEM TO BE SOLVED: To obtain a heat-insulation structure excellent in airtightness, by providing a substrate board at the upper end of eaves girder or the beam in an attic and seamlessly forming a heat-insulation layer on the surface thereof by wrapping up the eaves girder and the beam by means of spraying, pouring, etc. SOLUTION: Substrate boards 5 constituted of plywood, plastic panels, fiber boards, steel mesh boards, etc., are laid on eaves girders 3 or the beams 4 provided at the upper part of a ceiling 7 and a heat-insulation layer 6 is formed at the lower face thereof together with the wall face 8. This heat-insulation layer 6 is seamlessly formed to wrap up the eaves girder and the beam by spraying or injection of urethane foam, blowing of cellulose fiber, spraying and blowing of rockwool or glasswool, blowing of polystyrene beads, and blowing of ground foamed styrol. The heat-insulation layer 6 can be also laid on the upper face of the substrate boards 5. And further, it also can be used for the ventilation of eaves ceiling, the ventilation of attic space, and the ventilation of ridge to insulate heat by three layers of the ceiling layer, the heat-insulation layer, and the roof layer. In this way, airtightness of a house can be increased.
申请公布号 JPH0949272(A) 申请公布日期 1997.02.18
申请号 JP19950222649 申请日期 1995.08.07
申请人 ASUBITSUKU KK 发明人 MORIKAWA KIYOSHI
分类号 E04B9/00;E04B1/76 主分类号 E04B9/00
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