| 摘要 |
PROBLEM TO BE SOLVED: To obtain heat dissipation fins which make a reduction in the size of a substrate possible and decrease the number of wiring layers on the substrate possible. SOLUTION: Wirings for transmitting a signal between a plurality of devices 2a and 2b are respectively provided in heat dissipation fins 3 provided in such a way as to extend between the devices 2a and 2b provided on a substrate 1. Thereby, the number of wirings on the substrate can be decreased as many as the number of the wirings, which are provided in the fins, there is no need to make large the substrate and the fins 3, which do not require to increase also the number of wiring layers on the substrate, are obtained. |
