| 摘要 |
PROBLEM TO BE SOLVED: To prevent a resin case from separating from sealing resin. SOLUTION: A resin-sealed semiconductor device has a structure wherein power semiconductor elements 2 and an integrated circuit element 3 for control are mounted on a metal substrate 1, which is exemplified by an aluminium base material, the elements 2 and the element 3 are connected with each other through fine metal wires 4 and moreover, the elements 2 and 3 are housed in a resin case 5 and are sealed with sealing resin 6, such as epoxy resin, and a mounting of the substrate 1 to a heat sink is conducted by inserting parts of the heat sink in mounting holes 10 formed in mounting parts 9 provided at the end parts of the case 5 using bolts. Here, the mounting part 9 is formed integrally with the case 5, and the vicinities of the mounting part 9 are kept warped in the direction under the lower part of the drawing. By these warpages, warpages which are generated by a thermal stress and are generated in the mounting parts 9 in the direction of the lower part of the drawing, are cancelled and the generation of separation between the case 5 and the resin 6 can be prevented. |
