| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield of a semiconductor device by making the wafer thin to reduce the OH-resistance of an element in this device. SOLUTION: A semiconductor wafer 1 having pad electrodes 5 formed thereon is adhered to a strength-supporting plate 7 having a small thermal resistance and high insulation resistance by a first solder 11 through through-holes 10 and interconnection layers 8 and 9 to connect the wafer 1 to a lead frame electrode 12 through a metal layer 6 formed on the back side of a semiconductor chip 2, and the chip is also connected to another electrode 14 of the lead frame through interconnection layers 8 and 9 and plate 7 by a second and third solders 13 and 15. |
