发明名称 PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To improve the sealing quality of a package, by making its sealant pressing protrusions press in a line-contact manner the top and under surfaces of its salant with large pressing forces when mounting its upper cover portion on its main body portion. SOLUTION: On the top surface of a box-form main body portion, a flange 3 wherein a sealant storing groove 5 is formed in a closed loop manner is provided. On the under surface of an upper cover portion 2, a first sealant pressing protrusion 14 with an inversed chevron section is provided in a closed loop manner in the opposite position to the sealant storing groove 5 whereinto a closed-loop-form sealant 8 is inserted. On the bottom surface of the sealant storing groove 5 of the box-form main body portion, second sealant pressing protrusions 4a, 4b with chevron sections are provided in a closed loop manner. When the upper cover portion 2 is mounted on the flange 3, the first and second sealant pressing protrusions 14, 4a, 4b are contacted in a line- contact manner with the top and under surfaces of the sealant 8 in a closed loop manner. Hence, even when the pressing force of the upper cover portion 2 on the box-form main body portion is small, the good sealing quality of a package is obtained, and the upper cover portion 2 can be dismounted from the box-form main body portion by a small force.</p>
申请公布号 JPH0945759(A) 申请公布日期 1997.02.14
申请号 JP19950193792 申请日期 1995.07.28
申请人 MITSUBISHI MATERIALS SHILICON CORP;MITSUBISHI MATERIALS CORP 发明人 ENDO MITSUHIRO;MINAMI SHIYUUBIN;KIYONO YOSHIHIRO
分类号 B65D85/86;F16J12/00;F16J15/10;H01L21/673;H01L21/68;H05K5/06;(IPC1-7):H01L21/68 主分类号 B65D85/86
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