发明名称 WAFER CHUCK AND WAFER SUCTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To obtain a device which can reduce foreign substances blowing into the circumstance by each specific chuck main body, vacuum suction system and air releasing system being provided. SOLUTION: Inhaling ports 2b inhaling air 1 and opening ports 2c opening the air 1 are provided through a wafer mount face 2a and a chuck main part 2 which has an inhaling-side passage 2d connected with the inhaling ports 2b and has an opening-side passage 2e connected with the opening ports 2c, is provided. Also a vacuum suction system 5 having a first valve member 3 which is connected with the inhaling-side passage 2d and allows and closes the flow of the air 1 and having an air inhaling means 4 which inhaling the air 1, is provided. Additionally an air opening system 8 having a second valve member 6 which is connected with the opening-side passage 2e, and allows and closes the flow of the air 1 and having an air opening means 7 which releases the air 1, is provided. Also the flow of the air 1 at the inhaling-side passage 2d or at the opening-side passage 2e is made to be the same direction.</p>
申请公布号 JPH0945755(A) 申请公布日期 1997.02.14
申请号 JP19950189914 申请日期 1995.07.26
申请人 HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD 发明人 YAMAGAMI MASAHIRO
分类号 B65G49/07;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B65G49/07
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