| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip module package with which the melted solder on a sealing region can be prevented from flowing out to an internal metal film, and to provide the multichip module package on which various kinds of internal circuit parts can be arranged in close proximity to a solder sealing region. SOLUTION: A solder sealing region 35, to be provide on the circumference of an insulative board 31, is formed on the surface of the insulative board 31 and a metal film 36 is formed continuously on the surface inner than the sealing region 35 in the multichip module package. A solder flow-out inhibiting barrier 34 is provided on the boundary between the semiconductor sealing region 35 of the metal film 36 using a thin film material formed on the insulative board 31 for constitution of an electronic circuit, and the solder flow into the region inner than the solder sealing region 35 can be hindered. |
