| 摘要 |
PROBLEM TO BE SOLVED: To realize a package reduced in heat resistance, enhanced in electrical characteristics and increased in workability, using a metal plate provided with a copper foil, which is formed on a copper or aluminium metal plate via a polyimide insulator. SOLUTION: In a metal substrate, a copper base substrate coated with a polyimide 2 is formed into a comb-teethlike lead pattern 3 and a ground pattern 4, which is insulated from the pattern 3, by patterning a resist. On the other hand, a desired wiring pattern 12 is formed on a copper foil formed on the base substrate via the polyimide 2, through holes 11 are formed in the polyimide 2 held between the baser substrate and the copper foil for obtaining an electrical continuity between an island 15 for mounting a semiconductor chip 13 and the copper foil wiring pattern 12 and the copper base patterns (the patterns 3 and 4) and the holes 11 are filled with a metal plating. A semiconductor device is manufactured into a structure, wherein the chip 13 is sealed with a molding resin 1. |
