| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a structure, wherein the external joint ends of electrode terminals are parallel to the upper surface of the cap part of a container and the positional accuracy of the external joint ends is superior. SOLUTION: A semiconductor device is provided with a container 5, which has the opened upper part and are housed with semiconductor elements 9 and 10 therein, a cap part 1 for shutting the opening of the container 5 and electrode terminals 3 secured on the container 5. The cap part 1 is provided with terminal insertion holes 7, which penetrate from the lower surface of the cap part 1 to the upper surface of the cap part 1, the terminals 3 are inserted in the holes 7 and are led out from the upper surface of the cap part 1, the container 5 is jointed with the cap part 1 by bending external joint ends 3a of these led-out electrode terminals 3, the cap part 1 has projection parts 13 adjacent to the holes 7 on its upper surface and these projection parts 13 have a height which is parallel to the upper surface of the cap part 1 when the ends 3a are bent. |
