| 摘要 |
PROBLEM TO BE SOLVED: To avoid deteriorating the characteristics of a ceramic electronic component or degrading its appearance due to the adverse influence of a quick combustion or heating on its external electrodes, being apt to occur at a contact part of a conductive paste with an adhesive layer when the main body of the component coated with the paste is treated in a baking step to form outer electrodes on a part of the outer surface of the main body being held on a baking holder through the adhesive layer. SOLUTION: A banking holder 11 having recesses 14 for receiving main bodies of components 12 one by one is used, without forming an adhesive layer. The bodies 12 are positioned in the recesses 14 to hold them in the holder 11 and baking step is applied thereto. |
