| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability for the reflow temperature by securing the height of connection of a wiring board by a method wherein out of a plurality of wiring boards, three or more metal bumps are formed of metal having a melting temperature characteristics higher than the remaining metal bumps. SOLUTION: After the solder balls, as a plurality of metal bumps of high temperature melting solder, are mounted on the corresponding electrode terminals, solder ball electrode terminals 6A are formed on the board surface 2A of a circuit board 2. Then, after the solder balls of eutectic solder are mounted on the corresponding electrode terminals on the board surface of the circuit board 2, eutectic solder ball electrode terminals 6B are formed by conducting reflow treatment. At this time reflow temperature is set so that the high temperature solder ball electrode terminals 6A are not melted and the eutectic solder ball electrode terminals 6B are melted. As a result, the height of connection of a wiring board 7 can be sucured, and the reliability for the reflow temperature can also be improved.</p> |
