| 摘要 |
PROBLEM TO BE SOLVED: To resin-mold semiconductor elements continuously without stopping an apparatus. SOLUTION: By resin-sealing a lead frame on which a semiconductor element has been mounted, using a conveying mechanism 4 and a plurality of conveyable matal molds 3 provided with plungers, it becomes unnecessary to cause the metal molds 3 to stand by and stop for the thermal setting of resin in the press section 7 of a semiconductor manufacturing apparatus, and it becomes possible to cause a thermal setting time to elapse while they are outside the press section 7 of the apparatus. And it is possible to perform resin-sealing using another metal mold in the course of the standing by and to raise the production efficiency. Besides, it becomes unnecessary to stop the metal molds in the press section 7, since the resin dirt of the metal molds can be removed by separate metal mold cleaning by the use of an ultraviolet irradiation unit 10 and a cleaning unit 12 provided separately. |
