发明名称 MANUFACTURE OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To adopt constitution that a rigid laminated unitary body is formed and the tip part of a conductor bum is directly connected to a conductive metal foil, by achieving no-oxidation of the entire surface of the conductive metal foil in contact with the tip part of the conductor bump penetrating a synthetic-resin-based sheet, and roughening the surface. SOLUTION: A printed wiring board comprises a laminated element 7 wherein the tip part of a conductor bump 2 is protruding from the surface of a synthetic-resin- based sheet 3. One main surface is reduced and processed beforehand at the protruding surface. The rouphened surface is made to face, and a copper foil 8 is laminated and arranged. A polyimide-resin-based film as a protecting film 9 is laminated and arranged on the copper foil 8 and heated. With the film being compressed, the protecting film 9 is cooled and released. A double-surface copper-foil laminate layer 10, whose both surfaces are electrically connected, is formed. The copper foil 8 is minutely bonded to the surface of the synthetic-resin-based sheet 3 so as to form a unitary body. At the same time, the tip part of the conductor bump 2 penetrated into the synthetic-resin-based sheet 3 in contact with the surface of the copper foil 8 undergoes plastic deformation, and the same plane is formed. Therefore, the constitution that the tip part of the conductor bump is directly connected to the conductive metal foil can be adopted.
申请公布号 JPH0946041(A) 申请公布日期 1997.02.14
申请号 JP19950190232 申请日期 1995.07.26
申请人 TOSHIBA CORP 发明人 IKEGAYA FUMITOSHI
分类号 H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K3/40 主分类号 H05K3/38
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