发明名称 BONDING APPARATUS AND ITS OPERATING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent the lowering of the operation ratio of an apparatus caused by its stops. SOLUTION: First and second bonding heads 12, 14 capable of operating independently are provided, and the first and second bonding heads are united so as to be able to drive by ball screws 15, 16 respectively. And the correction of the Y-direction position of each bonding head is performed by a Y-table 17, and the correction of its X-direction position is performed by the movement of ball screws 15, 16. By this constitution, it becomes possible to move a bonding head standing-by and to cause it to perform bonding operation, even if something extraordinary such as a trouble, etc., occurs in a bonding head operating, and it becomes possible to cause the bonding head in trouble to evacuate and to repair it in the cource of bonding operation. Accordingly, it becomes possible to perform bonding operation continuously without stopping the apparatus itself.
申请公布号 JPH0945720(A) 申请公布日期 1997.02.14
申请号 JP19950197370 申请日期 1995.08.02
申请人 MATSUSHITA ELECTRON CORP 发明人 MURAYAMA TSUGIO;TANAKA SHOICHI;TACHIYANAGI MASAYA;TAMURA YOSHIKAZU
分类号 H01L21/60 主分类号 H01L21/60
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