| 摘要 |
PROBLEM TO BE SOLVED: To guarantee an excellent quality of connection free from dispersion in impedance between terminals after the connection and with a high connecting strength. SOLUTION: As insulating resin for bonding and fixing a terminal part 2 of the surface of a substrate and a terminal 7 of an electronic component, thermoplastic resin 3 and thermohardening resin 5 are used. The thermoplastic resin 3 is applied on the terminal part 2 of the substrate surface. Then, with the resin softened, conducting particles 4 are attached on the resin in a single layer at a constant density. Then the particles are fixed. The thermohardening resin 5 is applied on the entire region on the substrate 1, on which an electronic component 6 is mounted. The terminal 7 of the electronic component is positioned on the terminal 2 of the substrate surface. These parts are compressed and heated. Thus, the conducting particles 4 are fixed, and the terminal 7 of the electronic component is fixed on the substrate surface.
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