发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To easily obtain a fine pattern by consisting essentially of a polyamide acid ester having a specific weight average molecular weight, a photoinitiator and/or a photosensitizer in a photosensitive resin composition. SOLUTION: The photosensitive resin composition consists essentially of the polyamide acid ester 10000-40000 in weight average molecular weight measured by gel permeation chromatography basing on a polystyrene as a reference and having a structure expressed by formulas I, II, III, the photoinitiator and/or the photosensitizer. In formulas I-III, R1 expresses a 4-valent aromatic residue. R2 expresses a 2-valent organic group <=160 in molecular weight (average molecular weight in the case of a mixture of >=2 kinds) and each of R3 and R4 expresses a compound respectively formulas IV and formula V. R5 expresses a (2-6)-valent organic group, R5 expresses H or CH3 group. P is integers of 1-5. Each of (x), (y), (z) is a percentage of the respective structural unit and 0<x, y<100, 0<z<80 and x+y+z=100.
申请公布号 JPH0943842(A) 申请公布日期 1997.02.14
申请号 JP19950196264 申请日期 1995.08.01
申请人 SUMITOMO BAKELITE CO LTD 发明人 SASHITA NOBUYUKI;TAKEDA NAOJI;MAKABE HIROAKI
分类号 G03F7/027;C08L79/08;G03F7/029;G03F7/038;H01L21/027;(IPC1-7):G03F7/027 主分类号 G03F7/027
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