| 摘要 |
<p>PROBLEM TO BE SOLVED: To peel a tape for grinding from a wafer with a single peeling operation by providing a vacuum cleaner mechanism for causing dust/dirt adhered to a surface to leave and for sucking them while moving in one direction on the surface of the tape for grinding applied to the surface of the wafer. SOLUTION: A vacuum cleaning mechanism 5 moves left and right while bringing the tip of a capillary to the surface of a tape 4 for grinding of a wafer 11, thus causing a deposit on the tape 4 for grinding to leave and to be sucked and removed. Then, the surrounding is darkened and monochromatic light is projected to the tape 4 for grinding of the wafer 11 to inspect the presence or absence of the deposit. Then, the vacuum cleaning mechanism 5 is retreated to the side of a vacuum stage 6, a roller 3 for applying a tape is moved on the wafer 11 which has already been ground and a tape 2 is applied to the tape 4 for grinding. Then, a peeling tape wind-up part 1 is rotated and the tape 4 for grinding is peeled from the wafer 11.</p> |
