| 摘要 |
An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a finger lead assembly encapsulated within a body of non-conductive material, with a coplanar base support finger lead traversing an interconnect region. One terminal of the battery is welded to the base support finger lead, and the integrated circuit chip is bonded directly onto the other battery terminal by a layer of conductive epoxy. The stacked assembly of the integrated circuit chip, the battery and the base support finger lead is disposed within a central region whereby the stacked assembly, including gold interconnect wires, are completely encapsulated within the molded package body. <IMAGE> |
