发明名称 |
Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
摘要 |
A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.
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申请公布号 |
US5601678(A) |
申请公布日期 |
1997.02.11 |
申请号 |
US19950384586 |
申请日期 |
1995.01.23 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
GERBER, JOEL A.;GITS, PETER A. |
分类号 |
H01L23/538;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):B29C65/48 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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