发明名称 High-sensitivity positive-working photoresist composition
摘要 Disclosed is an improved positive-working photoresist composition comprising an alkali-soluble resin as a film-forming agent and a quinone diazide group-containing compound as a photosensitive agent. The most characteristic feature of the inventive composition consists in the unique formulation of the alkali-soluble resin which is a combination of two or three kinds of novolac resins selected from novolac resins (a), (b1) or (b2) and (c1) or (c2), each of which is characterized by the unique formulation of the phenolic compounds as a mixture to be subjected to a condensation reaction with an aldehyde compound to form the novolac resin. Namely, the phenolic mixture for the novolac (a) consists of m- and p-cresols, the phenolic mixture for the novolac (b1) consists of m-cresol and a xylenol, the phenolic mixture for the novolac (b2) consists of m- and p-cresols and a xylenol, the phenolic mixture for the novolac (c1) consists of m-cresol and a trimethyl phenol and the phenolic mixture for the novolac (c2) consists of m- and p-cresols and a trimethyl phenol each in a specified molar proportion of the constituent phenolic compounds.
申请公布号 US5601961(A) 申请公布日期 1997.02.11
申请号 US19950412889 申请日期 1995.03.29
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 NAKAYAMA, KAZUHIKO;NAKAO, TAKU;DOI, KOUSUKE;TOKUTAKE, NOBUO;KOHARA, HIDEKATSU;NAKAYAMA, TOSHIMASA
分类号 G03F7/022;C08G8/08;G03F7/023;H01L21/027;(IPC1-7):G03F7/023 主分类号 G03F7/022
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