| 摘要 |
A method and apparatus for measuring thermally induced warpage in test elements such as printed wiring boards and printed wiring assemblies, including a heating chamber having a transparent window and support structure for supporting a printing wiring board in an observation orientation and position parallel to the transparent window. A glass grating placed adjacent the window and a light source shines through the window onto the printed wiring board under test. A camera is positioned for capturing images of shadow moir+E,acu e+EE fringes formed over time as the oven heats up the printed wiring board or printed wiring assembly to simulate actual process conditions. A computer is used for controlling operation of the apparatus and for evaluating the captured images of the moir+E,acu e+EE fringes in relation to the temperature as a function of time.
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