发明名称 |
Semiconductor device and method for manufacturing same |
摘要 |
A semiconductor device includes a flat package substrate having a main surface on which is defined a semiconductor chip mount surface portion and onto which a semiconductor chip is to be mounted and a peripheral surface portion surrounding the semiconductor chip mount surface portion. An electrically insulating elastic layer is provided on the peripheral surface portion of the flat package substrate and a wiring pattern film is provided on an exposed main surface of the elastic layer. The wiring pattern film includes a base insulting film and wiring patterns which are formed on the base insulation film, each wiring pattern having a first end connected to an external connection terminal and a second end connected to the semiconductor chip. The semiconductor chip is sealed with a resin by potting.
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申请公布号 |
US5602059(A) |
申请公布日期 |
1997.02.11 |
申请号 |
US19950525078 |
申请日期 |
1995.09.08 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HORIUCHI, MICHIO;HARAYAMA, YOICHI |
分类号 |
C08G77/00;H01L21/60;H01L23/12;H01L23/14;H01L23/15;H01L23/24;H01L23/495;(IPC1-7):H01L21/60 |
主分类号 |
C08G77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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