发明名称 RELEASING DEVICE FOR MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To provide a releasing device for a molding die capable of releasing a resin sealed part from a die surely and completely by a method wherein when the resin sealed part is to be released from the die, a releasing means is released from the resin sealed part. SOLUTION: In a releasing device of a molding die for releasing a resin sealed part having a molded product and useless resin from the die when the die is opened, a first and a second injector pins 8, 9 for releasing the resin sealed part from the die, and a third injector pin 10 for releasing the first and second injector pins 8, 9 from the resin sealed part, are provided.
申请公布号 JPH0939041(A) 申请公布日期 1997.02.10
申请号 JP19950191825 申请日期 1995.07.27
申请人 APIC YAMADA KK 发明人 IKEDA MASANOBU
分类号 B22D17/22;B29C45/02;B29C45/14;B29C45/26;B29C45/40;B29L31/34;H01L21/56;(IPC1-7):B29C45/40 主分类号 B22D17/22
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