| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holding plate which can be easily separated by effectively applying water jet into bottom surface side of a semiconductor water when the polished semiconductor wafer is separated by the water jet in waxless polishing after polishing. SOLUTION: This plate is a wafer holding plate 2 in waxless polishing for mirror polishing a surface of a semiconductor wafer A in which a concave part 6 is continuously cut in a hole edge of a holding hole 3 for receiving and holding the semiconductor wafer A. |
