发明名称 |
Semiconductor wafer processing adhesives and tapes |
摘要 |
A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed. |
申请公布号 |
AU6177596(A) |
申请公布日期 |
1997.02.10 |
申请号 |
AU19960061775 |
申请日期 |
1996.06.13 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
RICHARD E BENNETT;GEARLD C. BIRD;MARK K NESTEGARD;ELEANOR RUDIN |
分类号 |
C09J7/02;C09J153/00;H01L21/301;H01L21/68 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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