发明名称 HIGHLY RIGID AND DAMPING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition combinedly having high rigidity and excellent damping property such as >=0.03 dissipation factor and >=30,000kgf/cm<2> flexural modulus at a room temperature. SOLUTION: This highly rigid and damping resin composition is composed of (a) 40-90wt.% a thermoplastic resin, (b) 3-20wt.% a block copolymer having a block structure of the formula: A(BA)n [A indicates a polymer block of an aromatic vinyl compound; B indicates a polymer block composed of isoprene or isoprene and butadiene, containing 3,4-bonding and 1,2-bonding in a total amount of >=40% and having a principal dispersion peak of tanδat >=0 deg.C; (n) is an integer of >=1] and (c) 7-40wt.% whiskers having 0.05-4μm average fiber diameter, 5-500μm average fiber length and >=7 aspect ratio.
申请公布号 JPH0940840(A) 申请公布日期 1997.02.10
申请号 JP19960106646 申请日期 1996.04.26
申请人 OTSUKA CHEM CO LTD 发明人 TAKARADA AKIRA;TASAKA TAKIO
分类号 C30B29/62;C08K7/00;C08K7/02;C08L53/00;C08L53/02;C08L101/00;(IPC1-7):C08L53/02 主分类号 C30B29/62
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