发明名称 INJECTION COMPRESSION MOLDING DIE OF THERMOPLASTIC RESIN AND INJECTION COMPRESSION MOLDING METHOD USING THE DIE
摘要 PROBLEM TO BE SOLVED: To prevent compression effect from being decreased in injection molding followed by compression. SOLUTION: A pin gate 10 is provided at a center of a top force 7, further a fixing pin 14 is protruded at a central position of a recessed part 5 for forming a cavity formed in a bottom force 3. Molten resin is injected into the cavity from an injection opening 10 under a state wherein the die is slightly opened. Thereafter, the bottom force 3 is raised, and the injection opening of the pin gate 10 is blocked with a tip of the fixing pin 14. Besides, the resin in the cavity is compressed.
申请公布号 JPH0939046(A) 申请公布日期 1997.02.10
申请号 JP19950192272 申请日期 1995.07.27
申请人 POLYPLASTICS CO 发明人 OTSUKA HIROMI
分类号 B29C45/56;B29C33/42;B29C45/26;B29C45/38;B29C45/70;B29K101/12;(IPC1-7):B29C45/56 主分类号 B29C45/56
代理机构 代理人
主权项
地址