| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. excellent in moisture resistance and moldability and useful for sealing semiconductor chips to produce sealed semiconductor devices by using a specific condensation-type phenol-aralkyl resin. SOLUTION: This compsn. essentially contains an epoxy resin, a condensation- type phenol-aralkyl resin represented by the formula (R is H or alkyl; Z is H,-CH2 -, or -CH2 OCH2 -; x and y are each 0-2 provided x+y≠0; and n>=1), an inorg. filler in an amt. of 25-90wt.% of the compsn., and a cure accelerator. Pref. the phenol-aralkyl resin is compounded in such an amt. that the molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the phenol-aralkyl resin is in the range of 0.1-1.5. Pref. the filler is a silica powder having an average particle size of 30μm or lower.
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