发明名称 PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a packaging body whose content volume is made larger before being packaged and made smaller when an object is packaged and heat- sealed. SOLUTION: A hollow molding of relatively thick synthetic-resin film is formed as a receptacle 2. The middle part of the bottom of the receptacle, except the peripheral part 5, is formed as a sunken part 6. A plurality of small projections 7 are provided on the inner surface of the sunken part. An upwardly working force causes the sunken part 6 to rise above the peripheral part 5 and the sunken part 6 can maintain this convex shape. After placing an object for packaging in the receptacle 2, the receptacle is covered with a thin film at the opening at the upper end to complete a packaging in a package 1.</p>
申请公布号 JPH0939932(A) 申请公布日期 1997.02.10
申请号 JP19950198632 申请日期 1995.08.03
申请人 OMORI MACH CO LTD 发明人 OMORI SHOZO
分类号 B65D21/08;B65D1/02;(IPC1-7):B65D1/02 主分类号 B65D21/08
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