| 摘要 |
PROBLEM TO BE SOLVED: To obtain an impact-resistant insulating resin compsn. which can form a highly impact-resistant insulating resin layer allowing no crack to occur even in a cutting process and is advantageously used for forming insulating resin layers for multilayered printed circuit boards. SOLUTION: This compsn. essentially contains fine rubber particles or an epoxy resin contg. fine rubber particles dispersed therein, a photosensitive polymer having a carboxyl group and at least two ethylenically unsatd. bonds in the molecule, a photopolymn. initiator, and a diluent. When this compsn. is of thermosetting type, it further contains an epoxy resin and an epoxy resin curative as essential components. |
