发明名称 HANDLING APPARATUS FOR RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To be able to easily separate a lead frame and to facilitate the discarding of unnecessary resin by forming a protrusion protruding from a region surrounded by the gate resin and sheath resin of a resin molding sandwiched between a sucking unit and a support. SOLUTION: Sucking and removing means 18 is first inserted into an opened mold, a moving block 19 is moved down, a cull resin 13a is sucked by a sucking unit 20, horizontally moved, carried out of the mold, and a cull 13a is disposed on a support member 22. When the cull resin 13a is pressed fixedly to the support 22 in this state, a lead frame 11 including sheath resin 5 is mounted on a support pallet 23. Then, when a cylinder 24 is rotated, the lead frame support pallet 23 is rotated at the rotary shaft as a center, the frame 11 is bent from the boundary between the resin 5 and a gate resin 16a, a deforming force and a positional deviation are operated at the boundary, the resin of the boundary is cut, and unnecessary resin is separated from the resin 5.
申请公布号 JPH0938997(A) 申请公布日期 1997.02.10
申请号 JP19950190220 申请日期 1995.07.26
申请人 NEC KANSAI LTD 发明人 UCHIYAMA NORIHIRO
分类号 B29C37/02;B29C45/38;B29C45/42;B29L31/34;H01L21/56;(IPC1-7):B29C37/02 主分类号 B29C37/02
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