| 摘要 |
PROBLEM TO BE SOLVED: To prepare a composite adhesive conductive resin film which does not require the removal of a base film, is free from various troubles, and improves the yield and production efficiency in die-bonding Si chips by forming a conductive adhesive layer on at least one side of a metal (mesh) sheet. SOLUTION: The use of a thin conductive sheet (e.g. a metal sheet) as a base film in place of a nonconductive base film (e.g. a polyester sheet) conventionally used for preparing a composite adhesive conductive resin film eliminates the need for removal of a base film from the composite adhesive film in using it. A metal (mesh) sheet made of a metal such as Au or Ag is used. The figure shows the section of the composite adhesive film comprising a pure Ag foil 1 and conductive adhesive layers 2 and 2. The composite adhesive film is prepd. by dissolving 100 pts.wt. polyimide resin in 300 pts.wt. solvent (dimethylacetamide), mixing the resultant soln. with 150 pts.wt. flaky pure Ag powder having an average particle size of 10μm, applying the resultant pasty mixture to both sides of a 0. 01mm-thick Ag foil, and treating the coated foil at 100 deg.C for 30min.
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