发明名称 MANUFACTURE OF CERAMIC MULTILAYER WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To restrain slipping and rising of layers at side faces of a ceramic, multilayer wiring board or at inner walls in a cavity. SOLUTION: A parts mounting section as a block maternal wherein a plurality of green sheets having conductor circuits printed thereon are superposed is created. On the top of it, two kinds of block materials, a seal section and a surface section, which have the conductor circuits printed thereon, have holes for mounting electronic parts, formed by superposing a plurality of green sheets, and have holes of different sizes are created and superposed in sequence. Further, the article obtained by superposing these three block materials is vacuum- packed in a state pinched by a pair of rubber sheets 6. Thereafter, it is warmed, placed in a pressure container 41 which is filled with static water and attached with pressure by isotropic pressure so as to form a green sheet laminated body. The green sheet laminated body is baked so as to manufacture a ceramic multilayer wiring board 1.</p>
申请公布号 JPH0939160(A) 申请公布日期 1997.02.10
申请号 JP19950189053 申请日期 1995.07.25
申请人 NEC CORP 发明人 ONODA SEIJI
分类号 B32B18/00;B32B37/06;B32B37/10;H05K3/46;(IPC1-7):B32B18/00;B32B31/20;B32B31/26 主分类号 B32B18/00
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