| 摘要 |
An integrated circuit chip card made by a plurality of lamina (11, 12, 13) and forming a chip module cavity (15) complementarily-shaped to the sides of the contact stratum of a chip module (14) for achieving a nested relation. A method and system of manufacturing an integrated circuit chip wherein one of said webs (A, B, C) forming the lamina (11, 12, 13) may be processed in parallel and wherein one of said webs has integrated chip modules (14) premounted thereon for subsequent lamination with the other webs (A, B, C), and wherein the registration of the webs (A, B, C) and seating of the integrated circuit chip module (14) within a cavity (15) occurs at substantially the same time, and while chemical bonding media therebetween remains fluid and open. The cards may be cut from the laminate while the chemical bond is not yet cured. |
