| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of failures, etc., caused by the disconnection of wires, etc., and, at the same time, to reduce the size of a sub-mount by making wire bonding unnecessary by forming conductor patterns on both surfaces of an insulating substrate facing each other and electrically connecting parts of the patterns to each other through a metallic via hole. SOLUTION: A sub-mount is manufactured by preparing an insulating substrate 1 having a metallic via hole 3 and grinding or polishing the surface of the substrate as necessary, and then, forming conductor patterns on both surfaces of the substrate 1. When the sub-mount is manufactured in such a way, no wire boding is required, because the conductor patterns 2 formed on both surfaces of the substrate 1 are connected to each other through the via hole 2. Therefore, the occurrence of defects caused by the disconnection of wires and damages to semiconductor laser elements or the occurrence of defects due to increased conductor resistances due to solder, etc., rising to the side face of the sub-mount when wires are bonded with solder can be prevented and the size of the sub-mount can be reduced. |
