| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ball grid array which can be improved in thermal shock resistance and reliability and, at the same time, can surely prevent the influence of external noise. SOLUTION: A ball grid array is provided with a milti-pin semiconductor element 1, a multilayer of signal layers 3a and 3b connected to the element 1 through bonding wires 2a and 2b, ground patterns 4a, 4b, and 4c arranged on both sides of the layers 3a and 3b, a through hole 5 one opening of which is formed at the same level with the patterns 4a, 4b, and 4c, and a conductive lid body 10 which watertightly covers the element 1 and bonding wires 2a and 2b. |
