| 摘要 |
PROBLEM TO BE SOLVED: To control the quantity of indium to be electrodeposited by subjecting a mercury (I) sulfate electrode to electroplating under presence of indium (III) ions, selenious acid ions, sulfuric acid and sodium citrate. SOLUTION: A plating bath is conditioned by dissolving ion exchange water to have a composition of 50mol/l of indium sulfate, 10mmol/l of selenium dioxide, 500mmol/l of sulfuric acid, and 50mmol/l of sodium citrate. Molybdenum is sputtered by 2μm, as a conductive layer, on a blue glass plate and copper is sputtered thereon to have total thickness of 0.3μm. It is employed as a positive electrode in a plating bath and a reference electrode, i.e., mercury (I) sulfate electrode, is subjected to electroplating at -1.21V with electric amount of 3.2C/cm<2> using a titanium/platinum plate as a cathode thus controlling the quantity of indium to be electrodeposited. |
