发明名称 EPOXY BASED FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy based flexible printed wiring board in which resin smear due to heating of drill is suppressed at the time of drilling a through hole, increase of labor is prevented and cost is lowered by facilitating the manufacture, and flexibility is imparted while sustaining the circuit characteristics of glass base epoxy resin board. SOLUTION: Copper patterns 2 are provided on the opposite sides of a glass base epoxy resin 1 and applied, on the outer side face thereof, with a protective layer 3 of epoxy resin thus forming a glass base epoxy resin flexible circuit board 4. Glass base epoxy resin circuit boards 7, each comprising copper foil patterns 6 provided on the opposite sides of a glass base epoxy resin 5, are hot pressed through a glass base epoxy resin prepreg 8, on the opposite sides of glass base epoxy resin flexible circuit board 4 at an appropriate part thereof thus forming a highly rigid part. Consequently, only the part of glass base epoxy resin flexible circuit board 4 is made flexible.
申请公布号 JPH0936499(A) 申请公布日期 1997.02.07
申请号 JP19950205119 申请日期 1995.07.20
申请人 AIREX:KK 发明人 UEHARA TOSHIHISA
分类号 H05K3/28;H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K3/28
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