RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the malfunction of a semiconductor device by improving the heat dissipating property of a BGA type package. SOLUTION: Inner leads 4 are bonded to an insulating film 3 joined to a semiconductor chip 1 and the leads 4 are connected to the electrode pads 2 of the chip 1 through metal thin wires 5. Then ball bumps 7 which are buried in the through holes of a resin body 6 so that the semipherical top parts of the bumps 7 can be protruded from the surface of the resin body 6 are connected to the leads 4.