SEMICONDUCTOR MANUFACTURING ADMINISTRATIVE USE CASSETTE, ITSPREPARATION AND SEMICONDUCTOR MANUFACTURING FACILITIES

摘要

PROBLEM TO BE SOLVED: To efficiently load/unload a cassette into/from a loader/unloader section so as to reduce damages to the wafers by protruding wings for a bar code outward from the side face of a container for housing the wafer and forming the bar codes on the wings. SOLUTION: Front and side wings 55 and 60 for bar codes are respectively protruded outward from the central parts of the front face and side face of a container 50 for housing the wafer. Bar codes are printed or stuck to the lower surfaces of the wings 55 and 60. In addition, bar codes are also printed or stuck to the rear face of the container 50. Therefore, damages to wafers can be reduced by efficiently loading/unloading a cassette into/from the loader/ unloader section 70 of a semiconductor manufacturing facility.