| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a transfer body device which can transfer a chip on a scribed wafer to a specific target position at high precision, and which has a simple structure, and its control method. SOLUTION: An XY table is moved so that an objective wafer chip can enter an image area of a CCD camera (S1), and the position of the objective wafer chip is calculated (S2). A vacuum finger is rotated on the objective wafer chip (S3), and the objective wafer chip is grasped at the top end of a finger by vacuum (S4 to S7). The vacuum finger is rotated by (180+θ) deg. such that a calculated misalignment (rotation angleθof a chip) is corrected (S8), and simultaneously the XY table is moved so that a recess that the objective wafer chip on a tray should be received is located just under the top end of the finger (S9). The wafer chip is released from the top end of the vacuum finger and received in the recess on the tray to complete the processing (S10 to S13).</p> |
