| 摘要 |
PROBLEM TO BE SOLVED: To fill up a gap between connected elements by a method wherein a mold equipped with films which are so set in thickness as to meet specific requirements for the mutual pitch, width, and height of an electronic part is used. SOLUTION: Provided that the width, mutual pitch, and thickness of a lead are represented by WL, PL, and TL. Provided that the thicknesses of an upper film 46a and a lower film 46b are represented by TTF and TBF. The films 46a and 46b are deformable and formed of ETFE film. When a requirement, C.TL- 1-WL/PL}<=(TTF+TBF), is satisfied, and C is so set as to satisfy a formula, C>=2.5, edges 48a and 48b are pressed against each other in the directions of arrows. Material extruded from either the upper film 46a or the lower film 46b is fully filled in a gap 50 between the leads to realize efficient encapsulation, and encapsulating material injected for encapsulation is restrained from flowing out through the gap 50, whereby the cavity of a mold is completely sealed up. By this setup, a tie bar can be dispensed with. |
