| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a multilayer printed wiring board of an interstitial via hole structure at a high yield and efficiently by a method wherein holes, which penetrate boards and bonding agent layers and come into contact with conductor circuits, are provided to form via holes filled with a conductive paste. SOLUTION: Conductor circuits 3a of a single-sided circuit board 7a are arranged on the surface on the upper side of a multilayer printed wiring board 1 and conductor circuits 3d of a single-sided circuit board 7d are arranged on the surface on the lower side of the board 1. Conductor circuits 3b of a single-sided circuit board 7b are arranged in the lower side of the board 7a and conductor circuits 3c of a single-sided circuit board 7c are arranged in the upper side of the board 7d. Via holes 6a are formed penetratingly an insulative hard board 2a and a bonding agent layer 4a, via holes 6b are formed penetratingly insulative boards 2b and 2c and bonding agent layers 4b and 4c, via holes 6d are formed penetratingly an insulative board 2d and a bonding agent layer 4d and a conductive paste 5 is filled in the respective via holes. |
