| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent electric conduction to an opposite-side substrate due to scatter of metal at the time of correcting defective wiring by positioning a spare scanning line or spare signal line directly below a sealing material. SOLUTION: Both spare signal lines are arranged directly below the seal material 15, or a terminal-side spare scanning line 19 is made to cross all scanning lines 4 on the terminal side at right angles across an insulating film 3 and arranged directly below the seal material 15. Further, a spare scanning line 20 which is not on the terminal side crosses all scanning lines 4 which are not on the terminal side at right angles across the insulating film 3 and arranged right below a seal material 17. Further, a liquid crystal injection hole 14 is positioned on the long side on the non-terminal side of an insulating substrate 2 when the spare scanning lines 19 and 20 are provided. This position relation is employed since the liquid crystal injection hole 14 disturbs wiring when present on the terminal side of an insulating substrate 2 and if the liquid crystal injection hole 14 is present directly above the non-terminal side spare scanning line 19, a metal piece of the part irradiated with laser light is scattered or a metallic film has a projection since the seal material 15 is not present at the part of the liquid crystal injection hole 14.</p> |
