SEMICONDUCTOR WAFER FIXING ADHESIVE TAPE

摘要

PROBLEM TO BE SOLVED: To greatly reduce the separation of a semiconductor device from the interface of a sealing material or the development of package cracks when the semiconductor is mounted by providing an adhesive layer including a silane coupling agent on a single side of a base material film. SOLUTION: A semiconductor wafer fixing adhesive tape is something which forms an adhesive layer on a base material film. The adhesive layer includes a silane coupling agent. The base material film adopts plastic, rubber or the like which are difficult to contaminate a semiconductor wafer and provide a large bonding force with the adhesive layer 1. The silane coupling agent is properly selected in conformity with the adhesive composition. Especially, when an amino silane based coupling agent, an epoxy silane based coupling agent are used, a bonding force between a semiconductor device and a sealing interface will be solidified. The loads of the silane coupling agent is desired to range from 0.1 to 50 parts by weight of the agent as for 100 parts by weight of the adhesive agent and preferably it ranges from 0.5 to 10 parts by weight.