| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding wire which is high in mechanical strength and suitable for a multi-pin semiconductor device, wherein the bonding wire is used for electrically connecting an electrode located on a semiconductor element to an outer lead. SOLUTION: A bonding wire includes 0.01 to 8% by weight of one or more elements selected out of rare earth elements besides Au as a main component. |
