| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a device where a tape carrier is used, wherein an inner lead or the like is prevented from being deformed caused by heat and getting out of position at bonding when the electrode of a semiconductor element is connected to an inner lead provided in the tape carrier. SOLUTION: A pulse heat semiconductor element pad 4 is made to ascend so as to align an inner lead 2 located on a tape carrier 1 with the electrode of a semiconductor element 3. Thereafter, a cartridge heater is built in a shank 5a, and a bonding tool 5 always heated at a temperature of 300 to 550 deg.C is made to descend. The pulse heat semiconductor element pad 4 is heated by a pulse heat system at the same time when the inner leads 2 and the electrodes of the semiconductor element 3 start being pressed. After a set press time elapses, the bonding tool 5 is made to ascend, and the pulse heat semiconductor element pad 4 is made to descend and cooled down. |
