BONDING OF ELECTRONIC COMPONENT,申请号JP19950206784-传众专利搜索

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发明名称	BONDING OF ELECTRONIC COMPONENT
摘要
申请公布号	JPH0936532(A)	申请公布日期	1997.02.07
申请号	JP19950206784	申请日期	1995.07.21
申请人	CASIO COMPUT CO LTD	发明人	YAMAMOTO MICHIHIKO
分类号	H01R4/02;H05K3/34;(IPC1-7):H05K3/34	主分类号	H01R4/02
代理机构		代理人
主权项
地址

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